Description
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
Features:
- 3D AOI
- Laser Line Scan Method
- Fastest Inspection Speed in the Industry
- Real 3D Image
- Inspection Irrelevant to Color, Material, Surface Roughness
- Inspection of up to 65mm Height
- Foreign Material & Contamination, PCB Warpage, Inspection without Additional Cycle Time
- Inspection Items
Dimension, Missing, Misalignment, Wrong, Side Mount, Tombstone, Text(OCR/OCV), Solder Joint, Lead Lift, Lead Missing, Lead Offset, Bridge, Color Band, Pin, Coplanarity, etc.
Björn Larsson
Head of Sales
Mats Klarholm
Senior Advisor and
Technical Sales
Sanel Merdovic
Head of Test and Service Department
Per Pedersen
Technical Sales and Projects
