Description
PARMI’s bottom-side 3D AOI solution uses advanced laser line scanning technology to perform fast, accurate, and reliable inspection of PCB assemblies.
The system inspects the bottom side immediately—without the need to flip the PCB or add extra cycle time. It is specifically designed to inspect through-hole device (THD) pins, wave and selective solder joints, and bottom-side SMD components.
The system also detects foreign materials, contamination, and PCB warpage. This enables manufacturers to identify defects earlier, improve process control, and maintain consistent production quality without creating additional bottlenecks.
Key benefits:
- High-precision 3D inspection of the PCB bottom side
- Advanced laser line scanning technology
- Extremely high inspection speed
- Immediate inspection without flipping the PCB
- No additional inspection cycle time
- Specialized inspection of THD pins and solder joints
- Detection of foreign materials and contamination
- Accurate PCB warpage measurement
- Improved process control, traceability, and production quality
Inspection applications:
THD pins, wave soldering, selective soldering, bottom-side SMD components, foreign materials, contamination, PCB warpage, and other critical assembly defects.
Björn Larsson
Head of Sales
Mats Klarholm
Senior Advisor and
Technical Sales
Sanel Merdovic
Head of Test and Service Department
Per Pedersen
Technical Sales and Projects
