Description
PARMI’s multi-purpose 3D AOI solution combines several inspection processes in one versatile platform. The same machine can inspect electronic components, solder paste, solder joints, epoxy, and conformal coatings—reducing the need for separate inspection systems.
Advanced laser line scanning technology delivers accurate 3D measurement and detailed inspection results. The system also detects foreign materials, contamination, and PCB warpage without adding unnecessary cycle time to the production process.
Application software can be configured according to the customer’s requirements, supporting SPI, AOI, and conformal coating inspection within a flexible and scalable solution.
Key benefits:
- Multiple inspection applications in one machine
- Inspection of components, solder, epoxy, and conformal coatings
- High-precision laser line scanning technology
- Support for SPI, AOI, and conformal coating inspection
- Software configuration based on production requirements
- Detection of foreign materials and contamination
- Accurate PCB warpage measurement
- Reduced equipment requirements and floor-space usage
- Improved flexibility, process control, and production efficiency
Inspection applications:
SMD components, solder paste, solder joints, epoxy, conformal coatings, foreign materials, contamination, PCB warpage, and other critical process deviations.
Björn Larsson
Head of Sales
Mats Klarholm
Senior Advisor and
Technical Sales
Sanel Merdovic
Head of Test and Service Department
Per Pedersen
Technical Sales and Projects
